New Vishay Siliconix 8-V to 30-V P-Channel PowerPAK SC-75 Power MOSFETs Feature On-Resistance as Low as 0.052 Ohms in 1.6-mm by 1.6-mm Footprint Area

MALVERN, PENNSYLVANIA — Vishay Intertechnology, Inc. (NYSE: VSH) today released a family of p-channel power MOSFETs in the PowerPAK SC-75, including several devices rated from 8V to 30V that are industry-firsts for their voltage ratings in this package type.

Among the devices being released today are the industry’s first -12-V (SiB419DK), and -30-V (SiB415DK) single p-channel power MOSFETs in the PowerPAK SC-75 package. The previously announced SiB417DK is the first such -8-V device and is joined today by an ESD-protected version with the same -8-V rating, the SiB417EDK. Both of these 8-V devices include on-resistance specifications down to VGS=1.2V, potentially allowing designers to reduce space requirements, power consumption, and solution cost by eliminating the need for level-shift circuitry. The new products also include two -20-V devices, the single SiB411DK and dual SiB911DK. On-resistance for the single devices at a 4.5-V gate drive ranges from 0.052 ohms to 0.066 ohms.

The Vishay Siliconix PowerPAK SC-75 power MOSFETs measure 1.6mm by 1.6mm by 0.75mm — the same area dimensions as the standard SC-75 — but offer much lower on-resistance thanks to a construction that accommodates a larger die within the same footprint. In addition to helping the environment by saving energy, the PowerPAK SC-75 is 100% lead (Pb)-free, halogen-free, and RoHS-compliant, meeting the demands of international legislation for elimination of hazardous substances.

The new PowerPAK SC-75 devices offer a new miniaturized package option to designers who are looking for ways to save space and reduce power consumption in portable electronic systems that are continually increasing in functionality. To meet consumer expectations for battery run times between charges, designers require smaller MOSFET packages with low power consumption, and this is just what the new PowerPAK SC-75 devices provide.

Typical applications for the p-channel PowerPAK SC-75 power MOSFETs will include load switching in cell phones, PDAs, digital cameras, MP3 players, and smart phones. The -30-V SiB415DK will also be used for load switching and driving white LEDs in notebook computers and other portable devices.

Samples and production quantities of the new PowerPAK SC-75 power MOSFETs are available now, with lead times of 10 to 12 weeks for larger orders.

Vishay Intertechnology, Inc., a Fortune 1,000 Company listed on the NYSE (VSH), is one of the world’s largest manufacturers of discrete semiconductors (diodes, rectifiers, transistors, and optoelectronics and selected ICs) and passive electronic components (resistors, capacitors, inductors, sensors, and transducers). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, and medical markets. Its product innovations, successful acquisition strategy, and ability to provide “one-stop shop” service have made Vishay a global industry leader. Vishay can be found on the Internet at http://www.vishay.com.

Hifn to Demonstrate a Unified Storage Platform at Intel Developer Forum 2008. As a New Affiliate Member of the Intel® Embedded Communications Alliance, Hifn Leverages Intel® Architecture and Support to Demonstrate a new Storage Platform

LOS GATOS, CA – Hifn™ (NASDAQ: HIFN), the catalyst behind storage and networking innovation, will demonstrate a Unified Storage Platform, highlighting the consolidation of multiple Enterprise-class storage applications onto a single high-performance storage system at the Intel Developer Forum 2008, August 19-21 at Moscone Center West in San Francisco, Booth #136. The Unified Storage demonstration reflects the benefits and opportunities available to Hifn customers, as an affiliate member of the Intel® Embedded Communications Alliance (Intel® ECA), which brings together market-leading technologies and third party solutions using Intel® architecture.

The Unified Storage platform demonstration combines key storage applications such as high-performance de-duplication, continuous data protection, back-up and secure distributed file services (DFS) all based on an Intel® 5100 MCH Chipset platform. The power of Intel architecture enables the Unified Storage Platform to support multiple storage applications on one platform. The purpose of a Unified Storage Platform is to eliminate the need for multiple single function storage devices thus freeing up space in the data center, reducing power consumption and cooling requirements, simplifying management, and significantly reducing total cost of ownership. The Unified Storage Platform as a solution is ideal for small- to medium-sized enterprises, and remote and distributed offices, as it provides Enterprise-class storage capabilities in an easy-to-manage, high-performance platform.

The Unified Storage demonstration combines key enabling Intel technology as well as Hifn’s Applied Services Processors and Express family of PCIe based cards. By supporting Intel® QuickAssist Technology, Hifn’s family of card accelerators provides system vendors using Intel® architecture with significantly improved time to market advantages.

The demonstration also utilizes the power of an Intel 5100 MCH Chipset platform, which features Intel® quad-core processors, Intel® Virtualization Technology (Intel® VT), Intel® I/O Acceleration Technology (Intel® I/OAT) and high-performance PCIe*. Hifn’s Applied Services Processors (ASPs) and Express family of cards off-load the computational intensive functions of encryption, compression, and hashing for security, and data-reduction and -de-duplication features. The continuous data protection and back up functions are supported by Microsoft’s DPM* and Symantec’s NetBackup* respectively.

“We are showing a new storage platform that is enabled through the processing power of Intel architecture and the purpose-built, hardware-advantaged capabilities from Hifn,” said Russell Dietz, VP and CTO at Hifn. “This demonstration is an example of how our support for the Intel® QuickAssist Technology initiative brings together complementary technology for the benefit of innovation.”

“The Unified Storage Platform demonstration is a good example of reducing space in storage applications by utilizing Intel® architecture,” said Troy Smith, director of marketing, Intel Embedded and Communications Alliance. “Being a member of the Embedded and Communications Alliance, which brings together market-leading technologies and third party solutions using Intel® architecture, enables Hifn to offer innovated solutions to meet market requirements.”

Hifn also plans to make additional information regarding the Unified Storage Platform demonstration available in the Intel ECA solutions directory following IDF.

About Hifn
Hifn (NASDAQ:HIFN) delivers the key channel and OEM ingredients for 21st century storage and networking environments. Leveraging over a decade of leadership and expertise in the development of purpose-built Applied Service Processors (ASPs), we are a trusted partner to industry leaders for whom infrastructure innovation in storage and networking is critical to success. With the majority of secure networked communications flowing through Hifn technology, the 21st century convergence of storage and networking drives our product roadmap forward. For more information, please visit: www.hifn.com.

Lincolnshire, Illinois - GF AgieCharmilles, an industry leader in the manufacture of high speed, high performance machine tools, will showcase the newest Ventricular Assist Device (VAD) from Jarvik Heart, Inc. in its booth (A-8343) at IMTS.

In April 2004, Dr. Robert Jarvik, the developer of the world’s first artificial heart, and his team were commissioned by the National Institutes of Health (NIH) to develop a VAD for children and infants with congenital heart defects. After extensive calculations and prototype testing, Jarvik Heart determined that manufacturing the necessary components required a machine that could create sharp angles at high levels of accuracy with surface finishes that exceeded the company’s existing equipment. After a round of test cuts, Jarvik Heart chose GF AgieCharmilles’ AC Classic V2 wire EDM.

“The AC Classic V2 delivered the precision and surface finish demanded by the part,” said Dr. Jarvik. “We have to hold steep angles within a 0.016º tolerance, while having the machine provide surface finish of around 0.06 µm. It is a demanding application and we couldn’t do it without the innovations found in GF AgieCharmilles’ wire EDM.”

The AC Classic V2 features an IPG-V generator that utilizes programmable logic arrays for precise control of the spark, allowing it to obtain high accuracy and surface finish. These high quality standards are not encumbered by high taper requirements due to the machine’s unique toriod tapering system.

About Agie Charmilles
Agie Charmilles is the North American leading supplier of wire EDM, CNC and manual diesinking systems and high speed/performance and 5-axis CNC milling machines. For more information on the company’s products and services, contact Gisbert Ledvon, Agie Charmilles, 560 Bond St., Lincolnshire, IL 60069-4224, Tel: 1-800-CTC-1EDM. Gisbert.Ledvon@AgieCharmilles.us, Fax: 847-913-5340, or visit http://www.gfac.com/us.